External Visual Inspection
Appearance test refers to confirming the number of chips received，inner packaging，Humidity indicator，Desiccant requirements and appropriate outer packaging。Second, the appearance inspection of a single chip，mainly include：Chip typing，years， Country of origin，Whether to recoat，Pin status，Are there any re-sand marks，Unknown residue，factorylogos position
We use support to detect208EachIC Produced by the manufacturer47000SpeciesICModel programming device。Provided include： EPROM，Parallel and serialEEPROM，FPGA，Configure serialPROM，Flash memory， BPROM，NOVRAM，SPLD，CPLD，EPLD，Microcontroller，MCUAnd standard logic device testing。
X-rayTesting is a real-time non-destructive analysis to check the hardware components inside the component，Mainly check the lead frame of the chip，Wafer size，Gold wire binding diagram，ESDDamage and holes， Customers can provide usable samples or previous purchases for comparison check。
Baking and Dry Packing
Our services also includeJ-STD-033B.1.For standard professional baking and vacuum packaging，This service protects the chip from moisture，Controlling solder reflow temperature，Keep the chip available and reliable。
Electrical and Temperature Testing
We provide extensive chip functional tests，From basic parameters to basisMilSTD883Confirm chip function，Especially complex chips such asFPGA, CPLD and PLA。
The test standard for solderability test isJ-STD-002B，This test mainly tests whether the soldering ability of the chip pins is up to standard。
Open the lid（Unblock）Mainly use the instrument to corrode the package on the chip surface，Check for wafers inside，Wafer size，Manufacturer's logo，Copyright year，Wafer code，Can determine the authenticity of the chip。
Pin Correlation Test
according todatasheetDevice pins and related descriptions specified by Chinese manufacturers，Using a semiconductor tube characteristic plotter，Through the open road、Short-circuit test to check the chip for damage。
Intel Will Set Up A Video Division In China, Focus On Video Technology Optimization
On October 12, Dr. Chen Wei, Vice President, Vice President of Intel Internet of Things, announced at the Intel Global Internet of Things, and Intel officially established the Global Video Division, and China is the headquarters of this business department. Internet of Things videoThe Division will focus on China's rapid growth video technology optimization.
Home Page> Industry Information> Wafer Manufacturers Put Into Automotive Chip Production Restrictions DDI Backend Test Manufacturers Earnings
15 days, sources pointed out that in order to cope with the intensive capacity of the substance, the display driving chip (DDI) supplier is turning to the 28/22 nm process to make new OLED DDI and DDI.The production ratios of these nodes will have increased significantly in 2022.